- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK TO-202 CLIP-ON 5W
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Board Level | Rectangular | 1.020" (25.91mm) | Clip | 1.0W @ 20°C | 8.00°C/W @ 200 LFM | 16.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rectangular, Fins | 0.745" (18.92mm) | Clip | 1.5W @ 40°C | 6.00°C/W @ 700 LFM | 24.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular, Fins | 0.745" (18.92mm) | Clip | 1.5W @ 40°C | 11.00°C/W @ 400 LFM | 24.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular, Fins | 1.020" (25.91mm) | Clip and PC Pin | 3.0W @ 50°C | 8.00°C/W @ 200 LFM | 16.80°C/W |
