- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.020" (25.91mm) | Clip and PC Pin | TO-220 | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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1.020" (25.91mm) | Clip and PC Pin | TO-220 | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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0.745" (18.92mm) | Clip | TO-202 | 1.5W @ 40°C | 11.00°C/W @ 400 LFM | 24.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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1.020" (25.91mm) | Clip and PC Pin | TO-202 | 3.0W @ 50°C | 8.00°C/W @ 200 LFM | 16.80°C/W |
