Discover 2 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Shape Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
655-53AB
Wakefield-Vette
2,632
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU 40.6MM SQ H=.525"
655 Square, Pin Fins 1.600" (40.64mm) Thermal Tape, Adhesive (Not Included) Assorted (BGA, LGA, CPU, ASIC...) 0.522" (13.27mm) 4.0W @ 40°C 2.00°C/W @ 400 LFM -
HS01
Apex Microtechnology
422
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TOP MT TO-3
Apex Precision Power Rhombus 1.000" (25.40mm) Bolt On TO-3 1.000" (25.40mm) 1.5W @ 20°C 2.00°C/W @ 600 LFM 11.60°C/W