- Manufacturer:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Selected conditions:
Discover 5 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Wakefield-Vette |
7,342
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON BLK
|
235 | Board Level | Bolt On | TO-220 | 2.0W @ 40°C | 6.80°C/W @ 400 LFM | 20.00°C/W | ||||
Advanced Thermal Solutions Inc. |
2,995
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CLIP-ON TO-220 BLK
|
- | Board Level | Bolt On | TO-220 | - | 9.00°C/W @ 200 LFM | 20.00°C/W | ||||
Advanced Thermal Solutions Inc. |
2,995
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CLIP-ON TO-220 W/TAB
|
- | Board Level, Vertical | Bolt On and PC Pin | TO-220 | - | 9.00°C/W @ 200 LFM | 20.00°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Clip | TO-220, TO-262 | 2.0W @ 40°C | 9.00°C/W @ 200 LFM | 18.80°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Clip and PC Pin | TO-220, TO-262 | 2.0W @ 40°C | 9.00°C/W @ 200 LFM | 18.80°C/W |