Discover 3 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Shape Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
BDN13-3CB/A01
CTS Thermal Management Products
652
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU W/ADHESIVE 1.31"SQ
BDN Top Mount Square, Pin Fins 1.310" (33.27mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.355" (9.02mm) - 6.00°C/W @ 400 LFM 16.10°C/W
LAE66A3CB
CTS Thermal Management Products
267
3 days
-
MOQ: 1  MPQ: 1
HEATSINK PWR .75"H BLACK TO-220
- Board Level Rhombus 0.900" (22.86mm) Bolt On TO-126, TO-220 0.750" (19.05mm) - 7.00°C/W @ 200 LFM 50.00°C/W
7-300-000-BA
CTS Thermal Management Products
Inquiry
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MOQ: 1  MPQ: 1
HEATSINK HORZ .62"H BLACK TO-220
7 Board Level Rectangular, Fins 1.090" (27.69mm) Bolt On TO-220 0.620" (15.75mm) 1.5W @ 40°C - -