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- Power Dissipation @ Temperature Rise：
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Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 14.
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Top Mount | - | 2.1W @ 75°C | 8.15°C/W @ 200 LFM | 35.71°C/W | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.9X15X9.5MM
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Board Level | SMD Pad | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - |
