Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Discover 2 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Type Shape Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
HF20G
Aavid, Thermal Division of Boyd Corporation
355
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO-220 TAB/CLIP-ON
Board Level, Vertical Rectangular, Fins 1.102" (28.00mm) Clip and PC Pin TO-220 0.787" (19.99mm) 1.0W @ 20°C 6.00°C/W @ 400 LFM 13.10°C/W
2286B
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level Square 0.790" (20.07mm) Thermal Tape, Adhesive (Not Included) BGA 0.155" (3.94mm) 1.0W @ 40°C 20.00°C/W @ 200 LFM -