- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Selected conditions:
Discover 3 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
CTS Thermal Management Products |
1,776
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.41"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.410" (35.81mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | 5.60°C/W @ 400 LFM | 16.20°C/W | Black Anodized | ||||
ASSMANN WSW Components |
1,214
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Rectangular, Fins | 0.878" (22.30mm) | Bolt On and Board Mounts | TO-220 | 0.252" (6.40mm) | - | 21.00°C/W | Tin | ||||
ASSMANN WSW Components |
685
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Rectangular, Fins | 0.878" (22.30mm) | Bolt On and Board Mounts | TO-220 | 0.252" (6.40mm) | - | 21.00°C/W | Black Anodized |