Discover 3 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Shape Width Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
BDN14-3CB/A01
CTS Thermal Management Products
1,776
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU W/ADHESIVE 1.41"SQ
BDN Top Mount Square, Pin Fins 1.410" (35.81mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.355" (9.02mm) 5.60°C/W @ 400 LFM 16.20°C/W Black Anodized
V5641B-T
ASSMANN WSW Components
1,214
3 days
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Board Level, Vertical Rectangular, Fins 0.878" (22.30mm) Bolt On and Board Mounts TO-220 0.252" (6.40mm) - 21.00°C/W Tin
V5641A-T
ASSMANN WSW Components
685
3 days
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Board Level, Vertical Rectangular, Fins 0.878" (22.30mm) Bolt On and Board Mounts TO-220 0.252" (6.40mm) - 21.00°C/W Black Anodized