- Manufacturer：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
1,950
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 19.
|
- | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
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CUI Inc. |
2,094
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
- | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
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|
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CUI Inc. |
2,094
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
- | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | ||
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Comair Rotron |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19.4X25.4X11.4MM
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SMD Pad | TO-263 (D2Pak) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - |
