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Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
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ASSMANN WSW Components |
25,551
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM CPU
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- | Top Mount | Aluminum | Square, Pin Fins | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.275" (7.00mm) | 31.00°C/W | Black Anodized | ||
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t-Global Technology |
5,067
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 10X10X2MM
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XL-25 | Heat Spreader | Ceramic | Square | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
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t-Global Technology |
2,715
|
3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 0.393" (10.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | ||
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t-Global Technology |
946
|
3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 0.393" (10.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | ||
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ASSMANN WSW Components |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.984" (25.00mm) | PC Pin | TO-220 | 0.894" (22.71mm) | 35.20°C/W | Tin | ||
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ASSMANN WSW Components |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.984" (25.00mm) | PC Pin | TO-220 | 0.894" (22.71mm) | 35.20°C/W | Black Anodized |
