- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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Discover 2 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
3,215
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3 days |
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .515"TO-220
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0.520" (13.21mm) | 0.515" (13.08mm) | 1.0W @ 30°C | 6.00°C/W @ 500 LFM | 19.70°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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0.900" (22.86mm) | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W |