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Discover 13 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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t-Global Technology |
5,198
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 20X20X2MM
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XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | - | ||
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t-Global Technology |
4,024
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | - | - | ||
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ASSMANN WSW Components |
3,125
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM TO-220
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- | Top Mount | Aluminum | Rectangular, Fins | 1.142" (29.00mm) | Bolt On | TO-220 | 0.472" (12.00mm) | - | - | 12.00°C/W | Black Anodized | ||
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t-Global Technology |
1,483
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER 20X20X6MM W/TAPE
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- | Heat Spreader | Ceramic | Square, Fins | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | - | - | ||
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t-Global Technology |
813
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER 20X20X6MM
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- | Heat Spreader | Ceramic | Square, Fins | 0.787" (20.00mm) | - | - | 0.236" (6.00mm) | - | - | - | - | ||
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ASSMANN WSW Components |
868
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level | Aluminum | Rectangular, Fins | 0.748" (19.00mm) | Bolt On and PC Pin | SOT-32, TO-220 | 0.844" (21.44mm) | - | - | 10.10°C/W | Black Anodized | ||
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t-Global Technology |
391
|
3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | - | - | ||
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ASSMANN WSW Components |
479
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.945" (24.00mm) | Bolt On and Board Mounts | TO-220 | 0.272" (6.90mm) | - | - | 21.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
970
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 STEEL W/TAB
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- | Board Level, Vertical | Steel | Rectangular | 1.220" (30.99mm) | PC Pin | TO-220 | 0.032" (0.80mm) | - | 13.00°C/W @ 200 LFM | 25.00°C/W | Tin | |||
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ASSMANN WSW Components |
322
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.984" (25.00mm) | PC Pin | TO-220 | 0.394" (10.00mm) | - | - | 35.00°C/W | Black Anodized | ||
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ASSMANN WSW Components |
76
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level | Aluminum | Rectangular, Fins | 1.142" (29.00mm) | Bolt On | TO-220 | 0.472" (12.00mm) | - | - | 15.00°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.1W ALUMINUM
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- | Board Level | Aluminum | Rectangular, Fins | 0.775" (19.68mm) | - | TO-220 | 0.303" (7.70mm) | 4.1W @ 75°C | 7.05°C/W @ 200 LFM | 18.29°C/W | Black Anodized | ||
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ASSMANN WSW Components |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular | 0.984" (25.00mm) | PC Pin | TO-220 | 0.394" (10.00mm) | - | - | 35.00°C/W | Tin |
