- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
18,047
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 14-16 DIP BLACK .19"
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0.731" (18.57mm) | Thermal Tape, Adhesive (Not Included) | 0.4W @ 30°C | 50.00°C/W @ 200 LFM | 68.00°C/W | ||
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ASSMANN WSW Components |
793
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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0.748" (19.00mm) | Press Fit | - | - | 48.00°C/W |
