- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
2,906
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3 days |
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SOLDERPIN/CLIP
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- | 1.375" (34.93mm) | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 400 LFM | 13.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | 1.650" (41.91mm) | TO-220 | 1.000" (25.40mm) | 12.0W @ 70°C | 4.00°C/W @ 200 LFM | 5.70°C/W | ||
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Wakefield-Vette |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS BLK 1.5"
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657 | 1.650" (41.91mm) | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | 3.30°C/W @ 200 LFM | - |
