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- Material：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
4,500
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218 SOLDER PIN
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- | Aluminum | 1.650" (41.91mm) | Bolt On and PC Pin | 1.000" (25.40mm) | 12.0W @ 70°C | 4.00°C/W @ 200 LFM | 5.50°C/W | ||
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CUI Inc. |
746
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 25
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HSE | Aluminum Alloy | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 8.1W @ 75°C | 3.09°C/W @ 200 LFM | 9.26°C/W | ||
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CUI Inc. |
748
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 25
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HSE | Aluminum Alloy | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 10.0W @ 75°C | 4.03°C/W @ 200 LFM | 7.50°C/W | ||
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CUI Inc. |
592
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION,TO-218, 25.
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HSE | Aluminum Alloy | 1.654" (42.00mm) | PC Pin | 0.984" (25.00mm) | 8.2W @ 75°C | 2.29°C/W @ 200 LFM | 9.15°C/W | ||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 25
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HSE | Aluminum Alloy | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 8.1W @ 75°C | 3.09°C/W @ 200 LFM | 9.26°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Aluminum | 1.650" (41.91mm) | Bolt On and PC Pin | 1.000" (25.40mm) | 12.0W @ 70°C | 4.00°C/W @ 200 LFM | 5.50°C/W |
