Package Cooled:
Power Dissipation @ Temperature Rise:
Discover 3 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Package Cooled Power Dissipation @ Temperature Rise
529702B02500G
Aavid, Thermal Division of Boyd Corporation
5,710
3 days
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MOQ: 1  MPQ: 1
BOARD LEVEL HEATSINK 1" TO-220
TO-220 4.0W @ 30°C
529701B02500G
Aavid, Thermal Division of Boyd Corporation
4,500
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO-218 SOLDER PIN
TO-218 12.0W @ 70°C
529701B02100G
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
TO-218 12.0W @ 70°C