- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 23 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
|
|
Wakefield-Vette |
5,350
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Adhesive | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
5,941
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | ||
|
|
|
Wakefield-Vette |
2,805
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | ||
|
|
|
Wakefield-Vette |
2,779
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.600" (15.24mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
7,117
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 27.9MM SQ W/ADH BLK
|
Thermal Tape, Adhesive (Included) | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
3,457
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK
|
Thermal Tape, Adhesive (Not Included) | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
3,025
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQBLK W/O TAPE
|
Thermal Tape, Adhesive (Not Included) | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | ||
|
|
|
Wakefield-Vette |
1,176
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQBLK W/O TAPE
|
Thermal Tape, Adhesive (Not Included) | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | ||
|
|
|
Wakefield-Vette |
4,276
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/OTAPE
|
Thermal Tape, Adhesive (Not Included) | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
839
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
1,243
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | ||
|
|
|
Wakefield-Vette |
642
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
673
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | ||
|
|
|
Wakefield-Vette |
2,122
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM |
