- Manufacturer：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Selected conditions:
Discover 3 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
CTS Thermal Management Products |
113
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.71"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.710" (43.43mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 3.80°C/W @ 400 LFM | 11.50°C/W | Black Anodized | ||
|
|
|
Ohmite |
92
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DUAL FOR TO-220/247 BLK
|
W | Board Level, Vertical | Rectangular, Fins | 1.200" (30.48mm) | Clip and PC Pin | TO-220, TO-247 (Dual) | 0.630" (16.00mm) | 4.0W @ 40°C | 6.00°C/W @ 200 LFM | 5.00°C/W | Black Anodized | ||
|
|
|
Ohmite |
27
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DUAL FOR TO-220/247
|
W | Board Level, Vertical | Rectangular, Fins | 1.200" (30.48mm) | Clip and PC Pin | TO-220, TO-247 (Dual) | 0.630" (16.00mm) | 4.0W @ 40°C | 6.00°C/W @ 200 LFM | 6.00°C/W | Degreased |
