- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 9.7X44.5X36.8MM
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Board Level, Vertical | 1.450" (36.83mm) | Bolt On and PC Pin | 0.380" (9.65mm) | 3.0W @ 30°C | 4.00°C/W @ 300 LFM | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 36.8X44.5X9.4MM
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Board Level | 1.450" (36.83mm) | Bolt On | 0.370" (9.40mm) | 4.0W @ 40°C | 4.00°C/W @ 300 LFM | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 17.8X44.5X12.7MM
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Board Level | 0.700" (17.78mm) | Bolt On | 0.500" (12.70mm) | 10.0W @ 70°C | 4.00°C/W @ 300 LFM | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 17.8X44.5X9.5MM
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Board Level | 0.700" (17.78mm) | Bolt On | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM |
