- Manufacturer：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Advanced Thermal Solutions Inc. |
2,884
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 DUAL BLACK
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Board Level | 1.470" (37.34mm) | Bolt On | - | 3.00°C/W @ 200 LFM | 9.60°C/W | |||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB FOLD 42.16MM
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Board Level, Vertical | 1.450" (36.83mm) | Bolt On and PC Pin | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 6.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | 1.450" (36.83mm) | Bolt On | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 6.80°C/W | ||
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Comair Rotron |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 9.7X44.5X36.8MM
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Board Level, Vertical | 1.450" (36.83mm) | Bolt On and PC Pin | 3.0W @ 30°C | 4.00°C/W @ 300 LFM | - |
