- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Selected conditions:
Discover 2 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | ||
Aavid, Thermal Division of Boyd Corporation |
283
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3 days |
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 LOW PROFILE .375"
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Bolt On | 10.0W @ 70°C | 3.00°C/W @ 400 LFM | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Bolt On and Board Mounts | 16.0W @ 90°C | 5.00°C/W @ 200 LFM |