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Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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ASSMANN WSW Components |
18,400
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK ALUM DPAK TO-252
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Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
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ASSMANN WSW Components |
18,715
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
|
|
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ASSMANN WSW Components |
18,715
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
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ASSMANN WSW Components |
430
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Square | 0.790" (20.07mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.155" (3.94mm) | 1.0W @ 40°C | 20.00°C/W @ 200 LFM | - | Black Anodized |
