- Length：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 11 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
994
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
|
Board Level | 0.748" (19.00mm) | PC Pin | 0.500" (12.70mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | ||
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|
|
CUI Inc. |
986
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
|
Board Level, Vertical | 0.500" (12.70mm) | PC Pin | 0.748" (19.00mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | ||
|
|
|
CUI Inc. |
995
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.3W ALUMINUM
|
Board Level | 0.591" (15.00mm) | - | 0.500" (12.70mm) | 2.3W @ 75°C | 11.04°C/W @ 200 LFM | 33.28°C/W | ||
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|
|
CUI Inc. |
972
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
|
Board Level, Vertical | 0.500" (12.70mm) | PC Pin | 0.748" (19.00mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | ||
|
|
|
CUI Inc. |
996
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.3W ALUMINUM
|
Board Level, Vertical | 0.500" (12.70mm) | PC Pin | 0.590" (15.00mm) | 2.3W @ 75°C | 11.04°C/W @ 200 LFM | 33.28°C/W | ||
|
|
|
CUI Inc. |
998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
|
Board Level | 0.748" (19.00mm) | - | 0.500" (12.70mm) | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | ||
|
|
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CUI Inc. |
475
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4W ALUMINUM
|
Board Level, Vertical | 1.500" (38.10mm) | PC Pin | 0.500" (12.70mm) | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W | ||
|
|
|
CUI Inc. |
360
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4W ALUMINUM
|
Board Level | 1.500" (38.10mm) | - | 0.500" (12.70mm) | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W | ||
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|
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.3W ALUMINUM
|
Board Level, Vertical | 0.500" (12.70mm) | PC Pin | 0.590" (15.00mm) | 2.3W @ 75°C | 11.04°C/W @ 200 LFM | 33.28°C/W | ||
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|
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CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4W ALUMINUM
|
Board Level, Vertical | 0.500" (12.70mm) | PC Pin | 1.500" (38.10mm) | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W | ||
|
|
|
CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4W ALUMINUM
|
Board Level | 1.500" (38.10mm) | PC Pin | 0.500" (12.70mm) | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W |
