- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Shape | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Shape | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
988
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3 days |
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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Rectangular | 3.8W @ 75°C | 6.12°C/W @ 200 LFM | 19.74°C/W | ||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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Rectangular, Fins | 3.7W @ 75°C | 6.84°C/W @ 200 LFM | 20.27°C/W | ||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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Rectangular, Fins | 3.1W @ 75°C | 7.07°C/W @ 200 LFM | 24.19°C/W |
