- Series:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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Discover 3 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | ||
CTS Thermal Management Products |
969
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Square, Fins | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | ||||
CTS Thermal Management Products |
438
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Square, Fins | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | ||||
Advanced Thermal Solutions Inc. |
100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 40MM X 40MM X 14.5MM
|
maxiGRIP, maxiFLOW | Square, Angled Fins | Clip, Thermal Material | BGA | 0.571" (14.50mm) |