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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.1W ALUMINUM
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Board Level | 0.787" (20.00mm) | - | 0.303" (7.70mm) | 4.1W @ 75°C | 7.05°C/W @ 200 LFM | 18.29°C/W | ||
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CUI Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 3.4W ALUMINUM
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Board Level, Vertical | 0.303" (7.70mm) | PC Pin | 0.790" (20.00mm) | 3.4W @ 75°C | 7.46°C/W @ 200 LFM | 22.06°C/W |
