Discover 6 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Shape Length Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow
625-25ABT4E
Wakefield-Vette
4,845
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU 25MM SQ W/DBL TAPE
625 Top Mount Square, Pin Fins 0.984" (25.00mm) Thermal Tape, Adhesive (Included) BGA 0.250" (6.35mm) 12.00°C/W @ 500 LFM
625-45AB
Wakefield-Vette
3,636
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU 25MM SQ H=.45" BLK
625 Top Mount Square, Pin Fins 0.984" (25.00mm) Thermal Tape, Adhesive (Not Included) BGA 0.450" (11.43mm) 8.00°C/W @ 400 LFM
678-39-S
Wakefield-Vette
913
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO-220/TO-247 SCREW
678 Board Level, Vertical Rectangular, Fins 2.362" (60.00mm) Bolt On and Board Mounts Assorted (BGA, LGA, CPU, ASIC...) 1.520" (38.61mm) 0.60°C/W @ 600 LFM
678-39-C
Wakefield-Vette
903
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO-220/TO-247 W/CLIP
678 Board Level, Vertical Rectangular, Fins 2.362" (60.00mm) Clip, Solder Foot Assorted (BGA, LGA, CPU, ASIC...) 1.520" (38.61mm) 0.60°C/W @ 600 LFM
625-45ABT3
Wakefield-Vette
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 25MM SQ W/DBL TAPE
625 Top Mount Square, Pin Fins 0.984" (25.00mm) Adhesive BGA 0.450" (11.43mm) 8.00°C/W @ 400 LFM
625-25ABT4
Wakefield-Vette
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 25MM SQ W/DBL TAPE
625 Top Mount Square, Pin Fins 0.984" (25.00mm) Thermal Tape, Adhesive (Included) BGA 0.250" (6.35mm) 12.00°C/W @ 500 LFM