- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Selected conditions:
Discover 10,336 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
Advanced Thermal Solutions Inc. |
1,953
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 9.5MM
|
- | Top Mount | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | 15.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,151
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X10MM L-TAB CP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 18.36°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
270
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 14.5MM
|
- | Top Mount | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 8.10°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
ASSMANN WSW Components |
1,035
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Clip and Board Mounts | TO-220 | 0.335" (8.50mm) | - | 18.00°C/W | Tin | ||
|
|
Advanced Thermal Solutions Inc. |
124
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X10MM R-TAB CP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 18.36°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,348
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X10MM R-TAB FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 28.85°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
350
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X20MM L-TAB FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 15.02°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
148
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 24.5MM
|
- | Top Mount | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 4.40°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,087
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 9.5MM
|
maxiGRIP | Top Mount | Clip, Thermal Material | BGA | 0.374" (9.50mm) | 15.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
499
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X14.5MM W/OUT TIM
|
- | Top Mount | Thermal Tape, Adhesive (Not Included) | BGA | 0.571" (14.50mm) | 8.10°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
187
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 14.5MM
|
maxiGRIP | Top Mount | Clip, Thermal Material | BGA | 0.571" (14.50mm) | 8.10°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
56
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X10MM L-TAB FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 28.85°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X25MM R-TAB CP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 7.01°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
96
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X20MM R-TAB FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 15.02°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
85
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X30MM R-TAB FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.181" (30.00mm) | 9.30°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
98
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X35MM R-TAB FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.378" (35.00mm) | 7.71°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
29
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 19.5MM
|
maxiGRIP | Top Mount | Clip, Thermal Material | BGA | 0.768" (19.50mm) | 5.70°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
ASSMANN WSW Components |
988
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Clip and Board Mounts | TO-220 | 0.335" (8.50mm) | - | 18.00°C/W | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
57
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X15MM R-TAB FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 20.35°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
73
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X25MM L-TAB FP
|
pushPIN | Top Mount | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 11.57°C/W @ 100 LFM | - | Blue Anodized |
