- Length：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Selected conditions:
Discover 8 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
913
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220/TO-247 SCREW
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678 | Board Level, Vertical | 2.362" (60.00mm) | Bolt On and Board Mounts | Assorted (BGA, LGA, CPU, ASIC...) | 1.520" (38.61mm) | 0.60°C/W @ 600 LFM | - | Black Anodized | ||
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Wakefield-Vette |
903
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-247 W/CLIP
|
678 | Board Level, Vertical | 2.362" (60.00mm) | Clip, Solder Foot | Assorted (BGA, LGA, CPU, ASIC...) | 1.520" (38.61mm) | 0.60°C/W @ 600 LFM | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X25X35MM
|
- | Top Mount | 11.800" (299.72mm) | Adhesive | - | 1.378" (35.00mm) | 2.50°C/W @ 200 LFM | 13.00°C/W | Degreased | ||
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Advanced Thermal Solutions Inc. |
76
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X25X22MM
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- | Top Mount | 11.800" (299.72mm) | Adhesive | - | 0.866" (22.00mm) | 3.90°C/W @ 200 LFM | 18.50°C/W | Degreased | ||
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ASSMANN WSW Components |
322
|
3 days |
-
|
MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | 0.787" (20.00mm) | PC Pin | TO-220 | 0.394" (10.00mm) | - | 35.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
17
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X25X25MM
|
- | Top Mount | 11.800" (299.72mm) | Adhesive | - | 0.984" (25.00mm) | 4.50°C/W @ 200 LFM | 11.70°C/W | Degreased | ||
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ASSMANN WSW Components |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
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- | Board Level, Vertical | 0.393" (10.00mm) | PC Pin | TO-220 | 0.894" (22.71mm) | - | 35.20°C/W | Tin | ||
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ASSMANN WSW Components |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | 0.393" (10.00mm) | PC Pin | TO-220 | 0.894" (22.71mm) | - | 35.20°C/W | Black Anodized |
