- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
4,845
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 12.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
3,636
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ H=.45" BLK
|
Thermal Tape, Adhesive (Not Included) | 0.450" (11.43mm) | 8.00°C/W @ 400 LFM | ||
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|
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Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
Adhesive | 0.450" (11.43mm) | 8.00°C/W @ 400 LFM | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 12.00°C/W @ 500 LFM |
