Discover 6 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Material Shape Length Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
XL25-20-20-2
t-Global Technology
5,198
3 days
-
MOQ: 1  MPQ: 1
XL25 CERAMIC BOARD 20X20X2MM
XL-25 Heat Spreader Ceramic Square 0.787" (20.00mm) - Assorted (BGA, LGA, CPU, ASIC...) 0.079" (2.00mm) - - -
XLI98-20-2.25-P
t-Global Technology
4,024
3 days
-
MOQ: 1  MPQ: 1
XL25 CERAMIC 20X20MM W/LI98C ADH
XL-25 Heat Spreader Ceramic Square 0.787" (20.00mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.089" (2.25mm) - - -
TG-CJ-LI-20-20-6-PF
t-Global Technology
1,483
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CER 20X20X6MM W/TAPE
- Heat Spreader Ceramic Square, Fins 0.787" (20.00mm) Thermal Tape, Adhesive (Included) - 0.236" (6.00mm) - - -
TG-CJ-20-20-6-PF
t-Global Technology
813
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CER 20X20X6MM
- Heat Spreader Ceramic Square, Fins 0.787" (20.00mm) - - 0.236" (6.00mm) - - -
XLI98C-20-2.15-P
t-Global Technology
391
3 days
-
MOQ: 1  MPQ: 1
XL25 CERAMIC 20X20MM W/LI98C ADH
XL-25 Heat Spreader Ceramic Square 0.787" (20.00mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.085" (2.15mm) - - -
ATS-PCB1022
Advanced Thermal Solutions Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 BLACK
- Board Level Aluminum Rectangular, Angled Fins 0.748" (19.00mm) Bolt On TO-220 0.433" (11.00mm) 20.00°C/W @ 200 LFM 30.00°C/W Black Anodized