- Manufacturer:
-
- Material:
-
- Attachment Method:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
Discover 6 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
t-Global Technology |
5,198
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 20X20X2MM
|
XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | ||||
t-Global Technology |
4,024
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC 20X20MM W/LI98C ADH
|
XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | - | ||||
t-Global Technology |
1,483
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 20X20X6MM W/TAPE
|
- | Heat Spreader | Ceramic | Square, Fins | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | - | ||||
t-Global Technology |
813
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 20X20X6MM
|
- | Heat Spreader | Ceramic | Square, Fins | 0.787" (20.00mm) | - | - | 0.236" (6.00mm) | - | - | - | ||||
t-Global Technology |
391
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC 20X20MM W/LI98C ADH
|
XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | - | ||||
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK
|
- | Board Level | Aluminum | Rectangular, Angled Fins | 0.748" (19.00mm) | Bolt On | TO-220 | 0.433" (11.00mm) | 20.00°C/W @ 200 LFM | 30.00°C/W | Black Anodized |