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Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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t-Global Technology |
5,198
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 20X20X2MM
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XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | ||
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t-Global Technology |
4,024
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3 days |
-
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MOQ: 1 MPQ: 1
|
XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | - | ||
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t-Global Technology |
1,483
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CER 20X20X6MM W/TAPE
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- | Heat Spreader | Ceramic | Square, Fins | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | - | - | ||
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t-Global Technology |
813
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER 20X20X6MM
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- | Heat Spreader | Ceramic | Square, Fins | 0.787" (20.00mm) | - | - | 0.236" (6.00mm) | - | - | - | ||
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t-Global Technology |
391
|
3 days |
-
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MOQ: 1 MPQ: 1
|
XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | - | ||
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Comair Rotron |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 20X5X25MM
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- | Board Level | Aluminum | Rectangular | 0.984" (25.00mm) | Clip | TO-220 | 0.197" (5.00mm) | 1.5W @ 40°C | 4.00°C/W @ 500 LFM | Black Anodized |
