- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
- Selected conditions:
Discover 7 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Board Level, Vertical | Copper | 1.180" (29.97mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | Tin | ||
|
|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19.4X25.4X11.4MM
|
Board Level | Copper | 0.763" (19.38mm) | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | Tin | ||
|
|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Board Level, Vertical | Aluminum | 0.942" (23.92mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | Black Anodized | ||
|
|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Board Level, Vertical | Aluminum | 1.180" (29.97mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | Black Anodized | ||
|
|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Board Level, Vertical | Aluminum | 1.180" (29.97mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | Black Anodized | ||
|
|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Board Level, Vertical | Copper | 1.180" (29.97mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | Black Paint | ||
|
|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Board Level, Vertical | Aluminum | 1.180" (29.97mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 5.00°C/W @ 500 LFM | Black Anodized |
