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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Selected conditions:
Discover 8 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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t-Global Technology |
120
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X25.4X0.062MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
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t-Global Technology |
78
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 101.6X25.4X0.21MM
|
PH3 | Heat Spreader | Copper | 4.000" (101.60mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
|
|
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t-Global Technology |
44
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X25.4X0.07MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
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t-Global Technology |
9
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X25.4X0.062MM
|
PH3n | Heat Spreader | Copper | 4.000" (101.60mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
|
|
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t-Global Technology |
7
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X25.4X0.07MM
|
PH3n | Heat Spreader | Copper | 4.000" (101.60mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
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|
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t-Global Technology |
20
|
3 days |
-
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MOQ: 1 MPQ: 1
|
PH3 76.2X25.4X0.21MM
|
PH3 | Heat Spreader | Copper | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Aluminum | 1.675" (42.55mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 4.0W @ 40°C | 4.00°C/W @ 300 LFM | 11.20°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | - | 1.675" (42.55mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 1.5W @ 20°C | 3.00°C/W @ 700 LFM | 12.40°C/W | Tin |
