- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Selected conditions:
Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
3,006
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK W/TAB BLACK
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1.220" (30.99mm) | Multiwatt, SIP | 2.0W @ 30°C | 4.00°C/W @ 300 LFM | 11.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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0.850" (21.59mm) | TO-220, TO-262 | 2.0W @ 40°C | 9.00°C/W @ 200 LFM | 18.80°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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1.180" (29.97mm) | TO-220 | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | 18.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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1.180" (29.97mm) | TO-220 | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | 18.00°C/W | Tin | ||
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Comair Rotron |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 25.4X12.7X30MM
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1.180" (29.97mm) | TO-220 | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | - | Black Anodized |
