- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Attachment Method | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Attachment Method | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
948
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 35MM SQ H=.45" BLK
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642 | Square, Fins | Thermal Tape, Adhesive (Not Included) | 6.00°C/W @ 500 LFM | ||
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Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR BGAS FIN HGT .45"
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630 | Square, Pin Fins | Thermal Tape, Adhesive (Not Included) | 4.00°C/W @ 400 LFM | ||
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Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR BGAS FIN HGT .45"
|
630 | Square, Pin Fins | Adhesive | 4.00°C/W @ 400 LFM |
