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Discover 12 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
302
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 35MM X 35MM X 12.5MM
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maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.378" (35.00mm) | Clip, Thermal Material | BGA | - | 3.00°C/W @ 200 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
1,290
|
3 days |
-
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MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 35X35X12.5MM
|
maxiFLOW, superGRIP | Top Mount | Aluminum | Square, Angled Fins | 1.378" (35.00mm) | Clip, Thermal Material | BGA | - | 3.00°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
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Advanced Thermal Solutions Inc. |
131
|
3 days |
-
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MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 35X35X12.5MM
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superGRIP | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Clip, Thermal Material | BGA | - | 5.40°C/W @ 200 LFM | - | Blue Anodized | ||
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Wakefield-Vette |
997
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3 days |
-
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MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 35X35X12.5MM
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Wave 3x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.378" (35.00mm) | Clip | BGA | - | 3.63°C/W @ 200 LFM | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
193
|
3 days |
-
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MOQ: 1 MPQ: 1
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ALUM HEAT SINK MAXIFLOW
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maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | - | 3.00°C/W @ 200 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
40
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 12.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | - | 3.00°C/W @ 200 LFM | - | Blue Anodized | |||
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|
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CUI Inc. |
382
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 0.984" (25.00mm) | PC Pin | TO-220 | 5.0W @ 75°C | 4.28°C/W @ 200 LFM | 15.00°C/W | Black Anodized | ||
|
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Advanced Thermal Solutions Inc. |
57
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 35MMX35MMX12.5MM W/O TI
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maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.378" (35.00mm) | Clip | BGA | - | 3.00°C/W @ 200 LFM | - | Blue Anodized | |||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 27
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.063" (27.00mm) | PC Pin | TO-220 | 6.0W @ 75°C | 3.64°C/W @ 200 LFM | 12.50°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 38
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.496" (38.00mm) | PC Pin | TO-220 | 7.4W @ 75°C | 3.94°C/W @ 200 LFM | 10.14°C/W | Black Anodized | ||
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|
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 50
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.969" (50.00mm) | PC Pin | TO-220 | 8.9W @ 75°C | 4.85°C/W @ 200 LFM | 8.43°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 63
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 2.480" (63.00mm) | PC Pin | TO-220 | 9.6W @ 75°C | 3.76°C/W @ 200 LFM | 7.81°C/W | Black Anodized |
