- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Wakefield-Vette |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK FOR BGAS FIN HGT .45"
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630 | Top Mount | Square, Pin Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | - | - | ||
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Wakefield-Vette |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK FOR BGAS FIN HGT .45"
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630 | Top Mount | Square, Pin Fins | 1.378" (35.00mm) | Adhesive | BGA | 0.450" (11.43mm) | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Rectangular, Fins | 1.774" (45.06mm) | Bolt On and PC Pin | TO-220 | 0.512" (13.00mm) | 3.0W @ 40°C | 10.00°C/W |
