- Manufacturer：
-
- Series：
-
- Material：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Selected conditions:
Discover 66 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
Advanced Thermal Solutions Inc. |
1,865
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 19.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.378" (35.00mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - | 2.20°C/W @ 200 LFM | - | |||
|
|
Advanced Thermal Solutions Inc. |
3,784
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 10.30°C/W @ 200 LFM | - | |||
|
|
|
Wakefield-Vette |
2,281
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X12MM ELLIPTICAL
|
908 | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Clip | BGA | 0.457" (11.60mm) | - | 3.10°C/W @ 200 LFM | 11.10°C/W | ||
|
|
|
Wakefield-Vette |
134
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X23MM PIN
|
908 | Top Mount | Aluminum | Square, Pin Fins | 1.378" (35.00mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.10°C/W @ 200 LFM | 8.80°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
522
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 19.5MM
|
- | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | 3.80°C/W @ 200 LFM | - | |||
|
|
Advanced Thermal Solutions Inc. |
163
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 24.5MM
|
- | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 2.90°C/W @ 200 LFM | - | |||
|
|
Advanced Thermal Solutions Inc. |
604
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 9.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.378" (35.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 5.30°C/W @ 200 LFM | - | |||
|
|
|
Ohmite |
161
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220 BLACK
|
E | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 8.0W @ 80°C | 4.00°C/W @ 300 LFM | 10.40°C/W | ||
|
|
|
Ohmite |
342
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220 BLACK
|
E | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 5.0W @ 40°C | 4.00°C/W @ 600 LFM | 7.50°C/W | ||
|
|
|
Wakefield-Vette |
191
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X12MM PIN
|
908 | Top Mount | Aluminum | Square, Pin Fins | 1.378" (35.00mm) | Clip | BGA | 0.457" (11.60mm) | - | 3.10°C/W @ 200 LFM | 11.10°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
183
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 11.30°C/W @ 200 LFM | - | |||
|
|
Advanced Thermal Solutions Inc. |
985
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 9.5MM
|
maxiGRIP | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 10.30°C/W @ 200 LFM | - | |||
|
|
Advanced Thermal Solutions Inc. |
1,714
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 19.5MM
|
maxiGRIP | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - | 3.80°C/W @ 200 LFM | - | |||
|
|
Advanced Thermal Solutions Inc. |
204
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 14.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.378" (35.00mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | - | 2.90°C/W @ 200 LFM | - | |||
|
|
Advanced Thermal Solutions Inc. |
119
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 35X35X9.5MM
|
fanSINK, maxiGRIP | Top Mount | Aluminum | Square, Pin Fins | 1.378" (35.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 2.60°C/W @ 200 LFM | - | |||
|
|
|
ASSMANN WSW Components |
2,270
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.185" (55.50mm) | Bolt On and Board Mounts | TO-220 | 0.500" (12.70mm) | - | - | 14.00°C/W | ||
|
|
|
Wakefield-Vette |
168
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X23MM ELLIPTICAL
|
908 | Top Mount | Aluminum | Square, Fins | 1.378" (35.00mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.10°C/W @ 200 LFM | 8.80°C/W | ||
|
|
|
CUI Inc. |
1,469
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.000" (25.40mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 5.5W @ 75°C | 4.39°C/W @ 200 LFM | 13.64°C/W | ||
|
|
|
CUI Inc. |
1,383
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.000" (25.40mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 5.2W @ 75°C | 4.42°C/W @ 200 LFM | 14.42°C/W | ||
|
|
|
CUI Inc. |
1,195
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.000" (25.40mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 5.5W @ 75°C | 8.36°C/W @ 200 LFM | 13.64°C/W |
