- Manufacturer：
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- Attachment Method：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Wakefield-Vette |
543
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER TO-220 TO-247
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- | Solderable Feet | TO-220, TO-247 | 3.80°C/W @ 200 LFM | 7.00°C/W | ||
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Ohmite |
37
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3 days |
-
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MOQ: 1 MPQ: 1
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CERAMIC HEATSINK WITH CLIP
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WC | Clip and PC Pin | TO-220, TO-247, TO-264 | - | 12.00°C/W |
