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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
1,123
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 6.4W @ 75°C | 3.86°C/W @ 200 LFM | 11.72°C/W | ||
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Wakefield-Vette |
997
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3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 45X45X12MM
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Wave 4x | Board Level | Square, Angled Fins | 1.772" (45.00mm) | Clip | BGA | 0.472" (12.00mm) | - | 2.96°C/W @ 200 LFM | - | ||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 38
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HSE | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 9.9W @ 75°C | 2.63°C/W @ 200 LFM | 7.58°C/W | ||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 50
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HSE | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 9.3W @ 75°C | 4.38°C/W @ 200 LFM | 8.06°C/W | ||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 63
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HSE | Board Level, Vertical | Rectangular, Fins | 2.500" (63.50mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 11.7W @ 75°C | 3.53°C/W @ 200 LFM | 6.41°C/W |
