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Discover 239 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
18,047
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 14-16 DIP BLACK .19"
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- | Top Mount | Aluminum | Rectangular, Fins | 0.250" (6.35mm) | 0.731" (18.57mm) | 14-DIP and 16-DIP | 0.190" (4.83mm) | 0.4W @ 30°C | 50.00°C/W @ 200 LFM | 68.00°C/W | Black Anodized | ||
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Wakefield-Vette |
2,632
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 40.6MM SQ H=.525"
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655 | Top Mount | Aluminum | Square, Pin Fins | 1.600" (40.64mm) | 1.600" (40.64mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.522" (13.27mm) | 4.0W @ 40°C | 2.00°C/W @ 400 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
1,686
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
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APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
199
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
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APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
969
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
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APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
139
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 15MM X 15MM X 9MM
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maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | ASIC | 0.354" (9.00mm) | - | 12.00°C/W @ 200 LFM | - | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
13,233
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 14-DIP/16-DIP
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- | Top Mount | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.250" (6.35mm) | 14-DIP and 16-DIP | 0.190" (4.83mm) | 0.4W @ 30°C | 30.00°C/W @ 500 LFM | 67.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
24,857
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 24-PIN DIP GLUE-ON BLK
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- | Top Mount | Aluminum | Rectangular, Fins | 1.250" (31.75mm) | 0.530" (13.46mm) | 24-DIP | 0.190" (4.83mm) | 1.0W @ 40°C | 15.00°C/W @ 500 LFM | 34.00°C/W | Black Anodized | ||
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Wakefield-Vette |
3,457
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK
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658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
3,025
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQBLK W/O TAPE
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658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,176
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQBLK W/O TAPE
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658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
4,555
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 14-16PIN DIP BLK
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651 | Top Mount | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.415" (10.54mm) | 14-DIP and 16-DIP | 0.240" (6.10mm) | 0.5W @ 40°C | 40.00°C/W @ 300 LFM | - | Black Anodized | ||
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Wakefield-Vette |
4,276
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/OTAPE
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658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
3,636
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ H=.45" BLK
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625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | BGA | 0.450" (11.43mm) | - | 8.00°C/W @ 400 LFM | - | Black Anodized | ||
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Wakefield-Vette |
4,378
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 43MM SQ BLK H=.65"
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628 | Top Mount | Aluminum | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | Black Anodized | ||
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Wakefield-Vette |
4,209
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
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Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | - | ||
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Wakefield-Vette |
900
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 128PQFP COMPOSITE
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Deltem | Top Mount | Composite | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | BGA | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | ||
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CTS Thermal Management Products |
371
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
368
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
3,767
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU .91" SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 0.910" (23.11mm) | 0.910" (23.11mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 9.60°C/W @ 400 LFM | 26.90°C/W | Black Anodized |
