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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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Discover 35 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
3,120
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218 W/PINS 1.5"TALL
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | 1.000" (25.40mm) | 10.0W @ 50°C | 2.00°C/W @ 500 LFM | 5.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
4,500
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218 SOLDER PIN
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | 1.000" (25.40mm) | 12.0W @ 70°C | 4.00°C/W @ 200 LFM | 5.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
3,101
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218 SOLDER PIN
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | 1.000" (25.40mm) | 12.0W @ 50°C | 1.00°C/W @ 800 LFM | 4.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
4,000
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218 10W H=2.5" BLK
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | Bolt On and PC Pin | 1.000" (25.40mm) | 20.0W @ 60°C | 2.00°C/W @ 300 LFM | 8.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
1,518
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 1.75" HI RISE TO-218
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- | Board Level, Vertical | Aluminum | Square, Fins | 1.750" (44.45mm) | 0.490" (12.44mm) | Clip and Board Mounts | 1.750" (44.45mm) | 4.0W @ 30°C | 1.50°C/W @ 400 LFM | 6.30°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
1,538
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-218 12W SPRING ACT
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.970" (50.04mm) | 1.950" (49.53mm) | Clip and PC Pin | 0.500" (12.70mm) | 4.0W @ 30°C | 1.00°C/W @ 500 LFM | 6.80°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
982
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218 W/TAB BLACK
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- | Board Level, Vertical | Aluminum | Rectangular, Angled Fins | 1.756" (44.60mm) | 0.492" (12.50mm) | Bolt On and Board Mounts | 1.756" (44.60mm) | - | 2.10°C/W @ 200 LFM | 6.30°C/W | Black Anodized | |||
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CUI Inc. |
746
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 25
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.000" (25.40mm) | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 8.1W @ 75°C | 3.09°C/W @ 200 LFM | 9.26°C/W | Black Anodized | ||
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CUI Inc. |
748
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 25
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.000" (25.40mm) | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 10.0W @ 75°C | 4.03°C/W @ 200 LFM | 7.50°C/W | Black Anodized | ||
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CUI Inc. |
592
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION,TO-218, 25.
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.000" (25.40mm) | 1.654" (42.00mm) | PC Pin | 0.984" (25.00mm) | 8.2W @ 75°C | 2.29°C/W @ 200 LFM | 9.15°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.380" (35.05mm) | Bolt On | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | 11.00°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 25
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.000" (25.40mm) | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 8.1W @ 75°C | 3.09°C/W @ 200 LFM | 9.26°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 31
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.250" (31.75mm) | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 9.8W @ 75°C | 3.63°C/W @ 200 LFM | 7.65°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 38
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.500" (38.10mm) | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 12.0W @ 75°C | 3.52°C/W @ 200 LFM | 6.25°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 38
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.500" (38.10mm) | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 12.0W @ 75°C | 3.52°C/W @ 200 LFM | 6.25°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On | 1.000" (25.40mm) | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 5.00°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 31
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.250" (31.75mm) | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 10.0W @ 75°C | 4.33°C/W @ 200 LFM | 7.50°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 38
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 1.500" (38.10mm) | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 12.0W @ 75°C | 3.79°C/W @ 200 LFM | 6.25°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | Bolt On | 1.000" (25.40mm) | 16.0W @ 50°C | 2.50°C/W @ 200 LFM | 3.80°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-218, 50
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HSE | Board Level, Vertical | Aluminum Alloy | Rectangular, Fins | 2.000" (50.80mm) | 1.638" (41.60mm) | PC Pin | 0.984" (25.00mm) | 12.8W @ 75°C | 2.98°C/W @ 200 LFM | 5.86°C/W | Black Anodized |
