- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Selected conditions:
Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Wakefield-Vette |
5,941
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.350" (8.89mm) | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
6,099
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB FOLD 42.16MM
|
- | Board Level, Vertical | Rectangular, Fins | 1.450" (36.83mm) | 1.300" (33.02mm) | Bolt On and PC Pin | TO-220 | 0.470" (11.94mm) | 8.0W @ 70°C | 8.70°C/W | ||
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Wakefield-Vette |
3,025
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQBLK W/O TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.350" (8.89mm) | - | - | ||
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Wakefield-Vette |
1,243
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.350" (8.89mm) | - | - | ||
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Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.350" (8.89mm) | - | - |