- Manufacturer：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
134
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 35X35X23MM PIN
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908 | Top Mount | Square, Pin Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.10°C/W @ 200 LFM | ||
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Wakefield-Vette |
168
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 35X35X23MM ELLIPTICAL
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908 | Top Mount | Square, Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.10°C/W @ 200 LFM | ||
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ASSMANN WSW Components |
106
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level | Rectangular, Fins | 1.575" (40.01mm) | 0.748" (19.00mm) | Bolt On and PC Pin | SOT-32, TO-220 | 0.844" (21.44mm) | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Rectangular, Fins | 1.750" (44.45mm) | 1.760" (44.70mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.400" (10.16mm) | 6.0W @ 60°C | 6.00°C/W @ 400 LFM |
