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Discover 32 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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t-Global Technology |
166
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3 days |
-
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MOQ: 1 MPQ: 1
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PH3 101.6X38.1X0.21MM
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PH3 | Heat Spreader | Copper | Rectangular | 4.000" (101.60mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | Polyester | ||
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Ohmite |
477
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-247 WITH 1 CLIP
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C | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.984" (25.00mm) | Clip and PC Pin | TO-247 | 0.710" (18.03mm) | 5.0W @ 60°C | 6.00°C/W @ 350 LFM | Black Anodized | ||
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Ohmite |
215
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK AND CLIPS FOR 2 TO-220
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C | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.969" (50.00mm) | 2 Clips and PC Pin | TO-220 | 0.710" (18.03mm) | - | - | Black Anodized | ||
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Ohmite |
368
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-247 WITH 2 CLIPS
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C | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.969" (50.00mm) | 2 Clips and PC Pin | TO-247 | 0.710" (18.03mm) | 2.5W @ 30°C | 5.00°C/W @ 200 LFM | Degreased | ||
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Ohmite |
296
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-247 WITH 2 CLIPS
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C | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.969" (50.00mm) | 2 Clips and PC Pin | TO-247 | 0.710" (18.03mm) | 2.5W @ 30°C | 5.00°C/W @ 200 LFM | Black Anodized | ||
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Ohmite |
209
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 WITH 3 CLIPS
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C | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.953" (75.00mm) | 3 Clips and PC Pin | TO-247 | 0.710" (18.03mm) | 2.5W @ 20°C | 2.00°C/W @ 300 LFM | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
361
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 40X38X10MM NYLONPUSHPIN
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maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.575" (40.01mm) | Push Pin | BGA | 0.394" (10.00mm) | - | 3.90°C/W @ 300 LFM | Green Anodized | |||
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Advanced Thermal Solutions Inc. |
106
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 40X38X25MM PEM
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maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.575" (40.01mm) | Push Pin | BGA | 0.984" (25.00mm) | - | 1.60°C/W @ 300 LFM | Green Anodized | |||
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Ohmite |
388
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 WITH 1 CLIP
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.984" (25.00mm) | Clip and PC Pin | TO-247 | 0.710" (18.03mm) | 5.0W @ 60°C | 6.00°C/W @ 350 LFM | Degreased | ||
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|
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Ohmite |
175
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK AND CLIP FOR 2 TO-220
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.969" (50.00mm) | 2 Clips and PC Pin | TO-220 | 0.710" (18.03mm) | - | - | Degreased | ||
|
|
|
Ohmite |
135
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIPS FOR 3 TO-220
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.953" (75.00mm) | 3 Clips and PC Pin | TO-220 | 0.710" (18.03mm) | - | - | Black Anodized | ||
|
|
|
Ohmite |
246
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 WITH 3 CLIPS
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.953" (75.00mm) | 3 Clips and PC Pin | TO-247 | 0.710" (18.03mm) | 2.5W @ 20°C | 2.00°C/W @ 300 LFM | Degreased | ||
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|
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Ohmite |
428
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK AND CLIPS FOR 3 TO-264
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C | Board Level, Vertical | Aluminum | Rectangular, Fins | 3.346" (85.00mm) | 3 Clips and PC Pin | TO-264 | 0.710" (18.03mm) | - | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
254
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X38X10MM PEM
|
maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.575" (40.01mm) | Push Pin | BGA | 0.394" (10.00mm) | - | 3.90°C/W @ 300 LFM | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
113
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X38X15MM PEM
|
maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.575" (40.01mm) | Push Pin | BGA | 0.590" (15.00mm) | - | 2.50°C/W @ 300 LFM | Green Anodized | |||
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Advanced Thermal Solutions Inc. |
208
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X38X25MM BRASSPUSHPIN
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maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.575" (40.01mm) | Push Pin | BGA | 0.984" (25.00mm) | - | 1.60°C/W @ 300 LFM | Green Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
146
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X38X25MM NYLONPUSHPIN
|
maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.575" (40.01mm) | Push Pin | BGA | 0.984" (25.00mm) | - | 1.60°C/W @ 300 LFM | Green Anodized | |||
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|
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t-Global Technology |
76
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X38.1X0.062MM
|
PH3n | Heat Spreader | Copper | Rectangular | 4.000" (101.60mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | Polyester | ||
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|
|
t-Global Technology |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X38.1X0.07MM
|
PH3n | Heat Spreader | Copper | Rectangular | 4.000" (101.60mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | Polyester | ||
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|
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Ohmite |
87
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIP FOR TO-220
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.984" (25.00mm) | Clip and PC Pin | TO-220 | 0.710" (18.03mm) | - | - | Degreased |
