- Manufacturer：
-
- Series：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Selected conditions:
Discover 24 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
ASSMANN WSW Components |
6,712
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Aluminum | Rectangular, Fins | 0.334" (8.50mm) | Press Fit | 6-Dip and 8-Dip | 0.189" (4.80mm) | - | - | 80.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
1,169
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Aluminum | Rectangular, Fins | 0.748" (19.00mm) | Press Fit | 14-DIP and 16-DIP | 0.189" (4.80mm) | - | - | 46.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
13,233
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 14-DIP/16-DIP
|
- | Top Mount | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Thermal Tape, Adhesive (Not Included) | 14-DIP and 16-DIP | 0.190" (4.83mm) | 0.4W @ 30°C | 30.00°C/W @ 500 LFM | 67.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
2,946
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Aluminum | Rectangular, Fins | 0.900" (23.00mm) | Press Fit | 18-DIP | 0.189" (4.80mm) | - | - | 40.00°C/W | Black Anodized | ||
|
|
|
CUI Inc. |
958
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.6W ALUMINUM
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.520" (13.21mm) | PC Pin | TO-220 | 0.748" (19.00mm) | 2.6W @ 75°C | 10.68°C/W @ 200 LFM | 28.85°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
61565 EXTRUSION 0.19X0.25"X4
|
- | Top Mount | Aluminum | Rectangular, Pin Fins | 48.000" (1219.20mm) | Adhesive | - | 0.190" (4.83mm) | - | 21.20°C/W @ 200 LFM | - | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 4.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 4.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 4.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 4.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 4.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 4.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 3.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 3.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 3.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 3.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 4.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 4.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 4.00°C/W | - | ||
|
|
|
American Technical Ceramics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
|
Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.240" (6.10mm) | SMD Pad | - | 0.060" (1.52mm) | - | - | 3.00°C/W | - |
