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Discover 103 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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CUI Inc. |
1,467
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Rectangular, Fins | 0.984" (25.00mm) | 1.359" (34.50mm) | PC Pin | TO-220 | 0.492" (12.50mm) | 5.5W @ 75°C | 4.44°C/W @ 200 LFM | 13.64°C/W | Black Anodized | ||
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CUI Inc. |
1,469
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 5.5W @ 75°C | 4.39°C/W @ 200 LFM | 13.64°C/W | Black Anodized | ||
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CUI Inc. |
1,383
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 5.2W @ 75°C | 4.42°C/W @ 200 LFM | 14.42°C/W | Black Anodized | ||
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CUI Inc. |
1,016
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220,25.
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HSE | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 5.8W @ 75°C | 3.28°C/W @ 200 LFM | 12.93°C/W | Black Anodized | ||
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CUI Inc. |
1,123
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.772" (45.00mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 6.4W @ 75°C | 3.86°C/W @ 200 LFM | 11.72°C/W | Black Anodized | ||
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CUI Inc. |
1,061
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 50
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HSE | Board Level, Vertical | Rectangular, Fins | 1.969" (50.00mm) | 1.181" (30.00mm) | PC Pin | TO-220 | 0.472" (12.00mm) | 7.7W @ 75°C | 4.05°C/W @ 200 LFM | 9.74°C/W | Black Anodized | ||
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CUI Inc. |
1,195
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.378" (35.00mm) | PC Pin | TO-220 | 0.500" (12.70mm) | 5.5W @ 75°C | 8.36°C/W @ 200 LFM | 13.64°C/W | Black Anodized | ||
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Wakefield-Vette |
993
|
3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 32X32X12MM
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Wave 3x | Board Level | Square, Angled Fins | 1.260" (32.00mm) | 1.260" (32.00mm) | Clip | BGA | 0.472" (12.00mm) | - | 4.64°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
996
|
3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 29X29X12.7MM
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Wave 2x | Board Level | Square, Angled Fins | 1.142" (29.00mm) | 1.142" (29.00mm) | Clip | BGA | 0.500" (12.70mm) | - | 4.08°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 35X35X12MM
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Wave 3x | Board Level | Square, Angled Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 0.472" (12.00mm) | - | 3.83°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
997
|
3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 35X35X12.5MM
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Wave 3x | Board Level | Square, Angled Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 0.492" (12.50mm) | - | 3.63°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 35X35X15MM
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Wave 3x | Board Level | Square, Angled Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 0.590" (15.00mm) | - | 3.15°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 36.6X36.6X17.5MM
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Wave 3x | Board Level | Square, Angled Fins | 1.441" (36.60mm) | 1.441" (36.60mm) | Clip | BGA | 0.689" (17.50mm) | - | 2.55°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 34X34X21MM
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Wave 3x | Board Level | Square, Angled Fins | 1.339" (34.00mm) | 1.339" (34.00mm) | Clip | BGA | 0.827" (21.00mm) | - | 2.19°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
993
|
3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 35X35X21MM
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Wave 3x | Board Level | Square, Angled Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 0.827" (21.00mm) | - | 2.11°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
991
|
3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 42.5X42.5X11.7MM
|
Wave 4x | Board Level | Square, Angled Fins | 1.673" (42.50mm) | 1.673" (42.50mm) | Clip | BGA | 0.461" (11.70mm) | - | 3.40°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
969
|
3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 40X40X12.5MM
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Wave 4x | Board Level | Square, Angled Fins | 1.575" (40.00mm) | 1.575" (40.00mm) | Clip | BGA | 0.492" (12.50mm) | - | 3.16°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 40X40X12MM
|
Wave 4x | Board Level | Square, Angled Fins | 1.575" (40.00mm) | 1.575" (40.00mm) | Clip | BGA | 0.472" (12.00mm) | - | 3.36°C/W @ 200 LFM | - | Black Anodized | ||
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|
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Wakefield-Vette |
997
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 45X45X12MM
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Wave 4x | Board Level | Square, Angled Fins | 1.772" (45.00mm) | 1.772" (45.00mm) | Clip | BGA | 0.472" (12.00mm) | - | 2.96°C/W @ 200 LFM | - | Black Anodized | ||
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Ohmite |
101
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM HEATSINK 50MM BLK ANODI
|
CR | Board Level, Vertical | Rectangular, Fins | 1.969" (50.00mm) | 1.969" (50.00mm) | 3 Clips and PC Pin | TO-101 | - | - | - | 5.30°C/W | Black Anodized |
