- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
488
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.1W ALUMINUM
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Board Level, Vertical | 0.441" (11.20mm) | 0.866" (22.00mm) | PC Pin | 0.626" (15.90mm) | 6.50°C/W @ 200 LFM | 18.34°C/W | ||
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CUI Inc. |
486
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4.1W ALUMINUM
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Board Level | 0.625" (15.90mm) | 0.866" (22.00mm) | - | 0.440" (11.18mm) | 6.50°C/W @ 200 LFM | 18.34°C/W | ||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.1W ALUMINUM
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Board Level | 0.787" (20.00mm) | 0.775" (19.68mm) | - | 0.303" (7.70mm) | 7.05°C/W @ 200 LFM | 18.29°C/W |
