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- Power Dissipation @ Temperature Rise：
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- Selected conditions:
Discover 9 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
6,975
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/PINS BLK 2"
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Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 30°C | 1.50°C/W @ 500 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
3,101
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218 SOLDER PIN
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Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218 | 1.000" (25.40mm) | 12.0W @ 50°C | 1.00°C/W @ 800 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
125
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3 days |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 90X90X10MM
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Top Mount | Copper | Square, Fins | 3.543" (90.00mm) | 3.543" (90.00mm) | Push Pin | BGA | 0.394" (10.00mm) | - | 1.30°C/W @ 200 LFM | AavSHIELD 3C | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On | TO-218 | 1.000" (25.40mm) | 6.0W @ 30°C | 1.00°C/W @ 800 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On | TO-220 | 1.000" (25.40mm) | 6.0W @ 30°C | 1.50°C/W @ 500 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218 | 1.000" (25.40mm) | 12.0W @ 50°C | 1.00°C/W @ 800 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 30°C | 1.50°C/W @ 500 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Clip and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 30°C | 1.00°C/W @ 800 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Rhombus | 1.550" (39.37mm) | 1.550" (39.37mm) | Bolt On | TO-3 | 1.750" (44.45mm) | 10.0W @ 50°C | 2.00°C/W @ 400 LFM | Black Anodized |
